AM26LV31C

The AM26LV31C and AM26LV31I are BiCMOS quadruple differential line drivers with 3-state outputs. They are designed to be similar to TIA/EIA-422-B and ITU Recommendation V.11 drivers with reduced supply-voltage range.

The devices are optimized for balanced-bus transmission at switching rates up to 32 MHz. The outputs have very high current capability for driving balanced lines such as twisted-pair transmission lines and provide a high impedance in the power-off condition. The enable function is common to all four drivers and offers the choice of active-high or active-low enable inputs. The AM26LV31C and AM26LV31I are designed using Texas Instruments proprietary LinIMPACT-C60 technology, facilitating ultra-low power consumption without acrificing speed. These devices offer optimum performance when used with the AM26LV32 quadruple line receivers.

The AM26LV31C is characterized for operation from 0°C to 70°C. The AM26LV31I is characterized for operation from 45°C to 85°C

Supply voltage range, V_CC (see Note 1) . . . . . . . . . . . ....... 0.3 V to 6 V
Input voltage range, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 6 V
Output voltage range, V_O . . . . . . . . . . . . . . . .... . . . . . . . . . 0.3 V to 6 V
Package thermal impedance, _JA (see Note 2): D package . . . . . .73°C/W
                                               NS package . . . . . . . . . . . . . . . . . . .64°C/W
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . .. 260°C
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . 65°C to 150°C

† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
             2. The package thermal impedance is calculated in accordance with JESD 51-7.